Logo Logo Logo Logo Logo
  • Home
  • About Us
    • About CAD-IT
    • Our Group
    • Awards and Accolades
    • Our Customer Testimonials
    • Our Partners
    • Corporate Social Responsibility
  • IoT Centre
    • Internet of Things
    • ThingWorx Suite
      • ThingWorx Foundation
      • ThingWorx Analytics
      • ThingWorx Studio
      • ThingWorx Utilities
      • ThingWorx Industrial Connectivity
    • Our Capabilities
  • Solutions
  • Services
    • Consulting
    • Deployment
    • Training
    • Technical Support
  • Events
    • Upcoming
    • Past
  • Career
  • Contact
    • Contact Us
    • Our Offices
    • CAD-IT Singapore
    • CAD-IT China
    • CAD-IT UK/US
  • News
    • CAD-IT News
    • Partners’ News
  • Home
  • About Us
    • About CAD-IT
    • Our Group
    • Awards and Accolades
    • Our Customer Testimonials
    • Our Partners
    • Corporate Social Responsibility
  • IoT Centre
    • Internet of Things
    • ThingWorx Suite
      • ThingWorx Foundation
      • ThingWorx Analytics
      • ThingWorx Studio
      • ThingWorx Utilities
      • ThingWorx Industrial Connectivity
    • Our Capabilities
  • Solutions
  • Services
    • Consulting
    • Deployment
    • Training
    • Technical Support
  • Events
    • Upcoming
    • Past
  • Career
  • Contact
    • Contact Us
    • Our Offices
    • CAD-IT Singapore
    • CAD-IT China
    • CAD-IT UK/US
  • News
    • CAD-IT News
    • Partners’ News

26 Sep ANSYS and TSMC Empower Chip Manufacturers to Design Cutting-Edge Multi-Die Chip-Package Systems

Posted in Partners' News 0 Comments
Share

TSMC enables ANSYS solutions for InFO reference flows to create reliable electronic products As the number of smart, connected electronic devices...

Read More

15 Sep ANSYS Helps Startup Companies Create Tomorrow’s Products

Posted in Partners' News 0 Comments
Share

New Program Gives Up-and-Coming Companies Access to Simulation Tools Used by Established Industry Leaders  Startup companies can speed their innovative products...

Read More

13 Sep ANSYS AIM 17.2: Expanding Upfront Simulation for the Design Engineer

Posted in Partners' News 0 Comments
Share

The latest innovations for thermal manahement and bolted assemblies With today’s latest release of ANSYS AIM, organizations can accelerate product design...

Read More
Recent Posts
  • CAD-IT Wishes
  • CAD-IT Singapore and Portek International Pte Ltd entered into a contract to develop a Smart Port System
  • Does your Industry have Emergency Maintenance Plan?
  • Try it with Smart Manufacturing
  • Want to know more about Process Automation?
Categories
  • CAD-IT News
  • Corporate News
  • Corporate Social Responsibility (CSR)
  • Events
  • IoT Blog
  • Partners' News
  • Product Lifecycle Management (PLM)
  • Services Lifecycle Management (SLM)
  • Uncategorized
Archives
  • October 2022
  • September 2022
  • August 2022
  • July 2022
  • June 2022
  • May 2022
  • April 2022
  • March 2022
  • February 2022
  • January 2022
  • March 2021
  • February 2021
  • January 2021
  • December 2020
  • November 2020
  • October 2020
  • May 2019
  • February 2019
  • January 2019
  • December 2018
  • October 2018
  • September 2018
  • August 2018
  • July 2018
  • June 2018
  • May 2018
  • April 2018
  • February 2018
  • January 2018
  • October 2017
  • July 2017
  • June 2017
  • March 2017
  • February 2017
  • January 2017
  • November 2016
  • October 2016
  • September 2016
  • August 2016
  • July 2016
  • June 2016
  • April 2016
  • March 2016
  • February 2016
  • January 2016
  • December 2015
  • November 2015
  • October 2015
  • September 2015
  • August 2015
  • July 2015
  • June 2015
  • May 2015
  • April 2015
  • March 2015
  • February 2015
  • January 2015
  • December 2014
  • May 2012
  • March 2012
  • About Us
  • Solutions
  • IoT Centre
  • Events
  • News
  • Partners
  • Careers
  • Contact

Copyright © 2022. CAD-IT Consultants (Asia) Pte Ltd. All Rights Reserved.

Please leave your name and email address to download the file

[goal id=”2059″]