ANSYS and TSMC Empower Chip Manufacturers to Design Cutting-Edge Multi-Die Chip-Package Systems

TSMC enables ANSYS solutions for InFO reference flows to create reliable electronic products

As the number of smart, connected electronic devices grow, manufacturers of mobile, networking, automotive, industrial automation and healthcare applications need to design high performing and reliable products at a lower cost. To meet these growing demands, TSMC and ANSYS are collaborating to enhance and deliver the most comprehensive suite of design solutions for TSMC’s wafer-scale Integrated InFO packaging technology.

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