Integration and further miniaturization of integrated circuit (IC) technology is driven by the ever increasing demand for smart electronic devices. Design challenges in power integrity and reliability is due to interacting physics arising from shrinking geometries, especially in FinFETs, stacked-die and emerging 3D-IC architectures. The power noise integrity and reliability of the most complex ICs can be verified by simulating electromigration, thermal effects and electrostatic discharge phenomena. ANSYS simulation and modeling tools offer you early power budgeting analysis and accuracy needed for IC sign-off.
ANSYS uniquely offers a suite of multidomain, multiphysics solutions to support a chip-package-system (CPS) design flow. This ensures the chip meets power integrity and reliability requirements as both a stand-alone component and within the electronics system. ANSYS semiconductor solutions have also been certified at all leading foundries since 2006, indicating the the ultimate proof of accuracy. ANSYS solutions are used by more than 90 percent of the global semiconductor companies, including all of the top 20 companies.
As automotive infotainment units become more complex, designers turn to simulation at chip level to ensure reliable, noise-free performance. Using ANSYS RedHawk and ANSYS Q3D Extractor, NXP engineers designed a new IC chip for a digital automobile radio with a 75 percent footprint reduction, lower costs and superior sound quality.