PITTSBURGH, PA, August 25, 2020 – Ansys (NASDAQ: ANSS) achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This enables mutual customers to satisfy key power, thermal and reliability requirements for the world’s largest AI/ML, 5G, HPC, networking and autonomous vehicle chips.
Achieving power integrity and electromigration (EM) reliability for 3nm process technology remains a challenging signoff milestone. Traditional discrete EM and voltage-drop methodologies are no longer sufficient for signoff of the 3nm process, which integrates billions of transistors and delivers tremendous power and performance on a single die. 3nm requires a comprehensive power integrity, thermal integrity, and reliability analysis platform that Ansys delivers with Ansys RedHawk-SC and Ansys® Totem™.
The certification of RedHawk-SC for TSMC N3 process encompasses power network extraction, power integrity and reliability, signal EM, thermal reliability analysis for self-heat, thermal-aware EM and statistical EM budgeting. Redhawk-SC will analyze huge 3nm network designs by leveraging the elastic compute, big-data analytics and high capacity of its underlying Ansys® SeaScape™ infrastructure. Totem is similarly certified for transistor-level custom designs.